Appearance: Black Cure: Heat cure Product Benefits: - High purity
- 260ºC reflow capability for Pb-free applications
- Green product
- Excellent flow properties
Application: Encapsulant Typical Package Application: BGA, Chip scale packages, PBGA and Full arrays on LTCC LOCTITE ECCOBOND FP4470 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. Information provided by Loctite® |