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Metal adhesives
Master Bond EP21TP-2 Two Component Polysulfide Epoxy Adhesive and Sealant
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Polysulfide Sealant/Adhesive

Material Notes: EP21TP-2NV complies with RoHS3 Directive (EU) 2015/863. It is a new version of EP21TP-2, which has been discontinued.

Key Features:

  • One to one mix ratio
  • Tough, flexible bonds
  • Withstands thermal cycling
  • Room temperature curing epoxy polysulfide
  • Chemical resistance to fuels, oils, hydrocarbons and hydraulic fluids
  • Superior electrical insulation properties
Product Description: Master Bond EP21TP-2 is a two component epoxy polysulfide system formulated to cure at room temperature or more rapidly at elevated temperatures, with a one to one mix ratio by weight or volume. It’s a versatile material that can be used as an adhesive, coating, encapsulant and especially as a sealant. It resists a wide array of chemicals including water, gasoline, fuels, oils, hydrocarbons, hydraulic fluids and many acids and bases. Significantly, unlike many chemical resistant epoxy based materials, this system has excellent toughness. These properties enable EP21TP-2 to withstand rigorous thermal cycling as well as mechanical and thermal shocks. It bonds well to a variety of substrates, including metals, glass, ceramics and many rubber and plastic materials. The cured system has excellent electrical insulation properties. Its service temperature range is -80°F to +250°F. One unusual feature of EP21TP-2 is the influence of adding heat to the curing cycle. When cured at room temperature the Shore D hardness is 60-65; when cured at 200°F for 2-3 hours, its hardness is 15-20 Shore D. Therefore, to obtain the optimum properties, EP21TP-2 should be cured at room temperature. The color of Part A is tan and Part B is amber, although, other colors are available. Polysulfide based systems, including EP21TP-2, have been used as fuel tank sealants and as potting compounds for electrical connectors exposed to fuels, oils and lubricants, for many years now. EP21TP-2 is an excellent choice for use as a sealant, adhesive or potting system for aerospace, electronic, electrical, and specialty OEM where room temperature curing, toughness and chemical resistance to fuels and related compounds are desirable.

Product Advantages:

  • Convenient mixing: forgiving one to one mix ratio by weight or volume
  • Easy to apply — adhesive spreads evenly and smoothly
  • Ambient temperature curing imparts optimal chemical resistance and hardness
  • Produces tough, bonds; resistant to thermal cycling
  • Bonds well to similar and dissimilar substrates
  • Superb resistance to fuels and related chemicals

Information provided by Master Bond Inc.

Vendors:
Available Properties
  • Viscosity, Part B
  • Viscosity, Part A
  • Hardness, Shore D
  • Tensile Strength
  • Elongation at Break
  • Tensile Modulus
  • Adhesive Bond Strength, Tensile lap, Aluminum to Aluminum
  • Volume Resistivity
  • Dielectric Constant
  • CTE, linear
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Working Life, After mixing, 100 g batch
  • Shelf Life, in original, unopened containers
  
Property Data

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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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Metal adhesives
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