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Master Bond adhesives
CeramTec Rubalit® 708 HP Alumina, 96% (High Performance)
Categories: Ceramic; Oxide; Aluminum Oxide

Material Notes: Rubalit® 708 HP (High Performance) has been developed from Rubalit® 708S. This material shares the same chemical composition, is produced on the same plant and using the identical production technologies as in the case of Rubalit® 708S. As a result, proven paste systems can be used and product licensing is a lot easier. The improved Rubalit® 708 HP substrate generation has consistency in terms of thermal cycling resistance, thermal shock resistance, bending strength, surface quality, thermal conductivity even under extreme conditions. The high and consistent surface quality, making the substrate suitable even for thin-film applications, ensures in the case of electrical resistors, a lower noise factor, more stable resistor values, enhanced resistance to electrical shock loads, and greater reliability under laser trimming conditions. As a result, Rubalit® 708 HP substrates combine added integration density with greater power density. Rubalit® 708 HP is ideal for high-performance electronic applications, for hybrids and sensors, in the telecom, medical, aerospace, and consumer goods industries.

Vendors:
Available Properties
  • Density, DIN EN 993: part 2
  • Water Absorption, ASTM C373-88
  • Particle Size, Medium Grain (d50)
  • Modulus of Elasticity, DIN V ENV 843-2
  • Flexural Strength, DIN EN 1288, Bending Strength; Double-Ring (40 mm / 20 mm / 0.63 mm)
  • Volume Resistivity, IEC 345
  • Volume Resistivity, IEC 345
  • Volume Resistivity, IEC 345
  • Volume Resistivity, IEC 345
  • Dielectric Constant, IEC 250
  • Dielectric Constant, IEC 250
  • Dielectric Breakdown, DIN EN 60243
  • Dielectric Breakdown, DIN EN 60243
  • CTE, linear, DIN 51045
  • CTE, linear, DIN 51045
  • CTE, linear, DIN 51045
  • Specific Heat Capacity, ASTM-E1269
  • Thermal Conductivity, DIN EN 821: part 2; Laserflash
  • Al2O3
  
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Manufacturer Notes:
CeramTec North America

Category Notes
none

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