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Polymer Distribution
Hexcel® Redux® 610W (0.03 psf) Flame retarded epoxy film adhesive
Categories: Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are required. Redux 610 is a hot melt film which is free from solvents and consequently has a very low volatile content.

Features: Cures in 1 hour at 250°F; Good lap-shear performance up to 212°F; Good peel performance in sandwich structures up to 175°F; Meets the heat release requirements of IMO test MSC 61 (67); Good tack, drape and handleability; Very low volatile content and low out gassing properties; Available unsupported or with a very lightweight glass carrier.
Applications: Metal to metal bonding; Sandwich constructions; Flame retarded performance

Available Properties
  • Storage Temperature
  • Shear Strength, Lap Shear
  • Shear Strength, Lap Shear
  • Shear Strength, Lap Shear
  • Shear Strength, Lap Shear
  • Peel Strength, Floating Roller Peel
  • Peel Strength, Floating Roller Peel
  • Shelf Life
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