Product Highlights:- Superior thermal conductivity
- Low coefficient of thermal expansion (CTE)
- Excellent flow properties
- Superior dimensional stability
- Exceptional electrical insulation properties
- Easy mix ratio of 1:1 by weight or volume
Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. It has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 AOLV-1 offers an extensive service temperature range of -50°C to +120°C. It has outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 AOLV-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1631AOLV-1 also offers excellent chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its Excellent performance and ease of use KB 1631 AOLV-1 is widely used in electronics, optoelectronic, major OEM and similar applications. Typical Applications: - Potting
- Encapsulation
- Sealing
- Coating
- Bonding
Information provided by Kohesi Bond Custom Engineered Adhesives |
