| Main Applications: Mainly used as adhesives of encapsulating materials (epoxy molding plastics) for integrated circuits (LSI, VLSI, etc.), electronic components (diode, triode, etc.), and weak electric products (VTR, OP, etc.).Modified by unsaturated acid, the EOCN vinyl ester resin owns both the main chain of EOCN and unsaturated double bond, so that it integrates the excellent solidifying properties and adhesiveness of EOCN, and the fast-curing and photocurable capability of unsaturated ester. These features make it a preferable material to manufacture GFRP products that require excellent resistance to heat and corrosion and to be used as a photo-sensitive resin in the application of printing ink .Used as adhesives, coatings and laminated material for the applications that have special requirements for heat resistance, anti-corrosion and insulation.Properties and technical information: In addition to the general crosslinking performance of epoxy resin, EOCN features exceptional properties compared to ordinary epoxy resins. With the same softening point of 65-75 oC, the epoxy value of EOCN reaches 0.48-0.50eq/100g, while only 0.20eq/100g for the ordinary one. This fact means that its crosslinking points are 2.5 times more than usual, and its highlycrosslinked net with three-dimensional structure would be easily forming. With the phenolic framework additionally, the solidified products have excellent properties of heat stability, mechanical strength, electric insulation, waterproofness, low moisture absorption, resistance to chemicals, and higher glass transfer temperature Tg.Information provided by ChenGuang Research Institute of Chemical Industry |
