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Chemically Resistant adhesives
Rogers Corporation RT/duroid® 6202 High Frequency Laminate
Categories: Polymer

Material Notes: Features:
  • Low loss for excellent high frequency performance
  • Tight dielectric constant and thickness control
  • Excellent electrical and mechanical properties
  • Extremely low thermal coefficient of dielectric constant
  • In-plane expansion coefficient matched to copper
  • Very low etch shrinkage
  • Cladding - EDC
  • Lead-free process compatible

Typical Applications:

  • Phase Array Antennas
  • Ground Based and Airborne Radar Systems
  • Global Positioning System Antennas
  • Power Backplanes
  • High Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

Information provided by Rogers Corporation.

Vendors:
Available Properties
  • Density, ASTM D792
  • Moisture Absorption at Equilibrium, IPC-TM-650 2.6.2.1; ASTM D570, D23/24; D48/50
  • Thickness, Range of Standard Thicknesses
  • Tensile Strength, Ultimate, ASTM D638, X, Y direction
  • Elongation at Break, ASTM D638, X, Y direction
  • Tensile Modulus, ASTM D638, X, Y direction
  • Compressive Modulus, ASTM D638, Z direction
  • Peel Strength, IPC-TM-650 2.4.8, Copper
  • Volume Resistivity, ASTM D257, Condition A; Z direction
  • Surface Resistance, ASTM D257, Condition A; Z direction
  • Dielectric Constant, IPC-TM-650 2.5.5.5, Z direction
  • Dissipation Factor, IPC-TM-650 2.5.5.5, Z direction
  • CTE, linear, ASTM D3386; IPC-TM-650 2.4.41, X-Direction; TMA; 10°C/min
  • CTE, linear, ASTM D3386; IPC-TM-650 2.4.41, Y-Direction; TMA; 10°C/min
  • CTE, linear, ASTM D3386; IPC-TM-650 2.4.41, Z-Direction; TMA; 10°C/min
  • Specific Heat Capacity, calculated
  • Thermal Conductivity, ASTM C518
  • Decomposition Temperature, ASTM D3850, TGA
  • Flammability, UL94
  
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Manufacturer Notes:
none

Category Notes
Plastic

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Chemically Resistant adhesives
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