| Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user friendly system has an easy and convenient one to one mix ratio by weight. EP21LV-LO features outstanding physical strength properties, along with being an excellent electrical insulator. This combination of properties enables it to be readily used as a potting and encapsulation compound. EP21LV-LO resists many chemicals including water, oils, fuels, acids, bases and salts quite well. It bonds well to a variety of substrates including metals, glass, ceramics and many types of rubber and many plastics. To optimize its properties, the best cure schedule is 12-24 hours at room temperature, plus another 2 hours at 150-200°F. Most importantly, EP21LV-LO passes NASA low outgassing specifications. The color of Part A is clear and Part B is amber in color. It is serviceable over the wide temperature range of -60°F to +250°F. This versatile system is widely used in aerospace, microelectronics, semiconductor, optical and vacuum applications. Product Advantages: - Lower viscosity; convenient mixing; ideal for bonding, sealing, coating and encapsulation.
- Easily applied; adhesive spreads smoothly.
- High bonding strength to a wide variety of substrates.
- Excellent adhesion to similar and dissimilar substrates.
- Good electrical insulation properties.
- Superior durability, thermal shock and chemical resistance.
- Passes NASA low outgassing specifications.
Information provided by MasterBond® |
