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Master Bond adhesives
Henkel Loctite® ECCOBOND E 1172 A Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Tan

Cure: Heat Cure

Product Benefits:

  • One component
  • Fast cure at low temperatures
  • Low cure temperature
  • Void-free underfill
  • Low CTE
  • Non-anhydride curing chemistry
  • Long pot life
Application: Underfill

Typical Package Application: Flip chip devices

LOCTITE ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25 micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.

Information provided by Loctite®

Available Properties
  • Density
  • Filler Content
  • Moisture Absorption, Cured, 24-hr boil
  • Particle Size
  • Brookfield Viscosity, Uncured, Spindle 3, speed 5 rpm
  • Hardness, Shore D, Cured
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Cured
  • Glass Transition Temp, Tg, Cured
  • Shrinkage, on Cure
  • Cure Time, Fast Cure
  • Cure Time, Standard Cure
  • Cure Time, plus 5 minutes @ 135 °C, Low Stress Cure
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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