Product Highlights:- High glass transition temperature
- Non drip, even at elevated temperatures
- Castable up to 3 inches
- Superior resistance to fuels, oils & water
- Exceptional electrical insulation properties
- 100% solids system (no VOCs)
Kohesi Bond KB 1452 HT-2 (Non Drip) is a two component, room temperature curing, chemically resistant epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This epoxy system offers excellent adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1452 HT-2 (Non Drip) offers a non sagging viscosity, even at temperatures above ambient. It offers first-rate resistance to various oils, fuels, acids and also to boiling water. It offers an extensive service temperature range of -50°C to +230°C. This adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure (< 0.1%) and is castable up to 3 inches depth. It has superior electrical insulation properties. It is black in color. KB 1452 HT-2 (Non Drip) is widely used in the aerospace, electronics, medical, oil, pipes, tanks, fittings and other related OEM industries. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
