Product Highlights:- Easy mix ratio of 1:1 by weight or volume
- Outstanding flexibility
- Superior thermal conductivity
- High peel strength
- Nickel filled, electrically conductive
- Cryogenic service
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. It offers very good electrical conductivity and a first-rate peel strength. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1031 ATFL-N can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers a service temperature range of 4K (-269.15°C) to +120°C. It is an adhesive that offers superb physical strength properties and elongation, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1031 ATFL-N adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It offers chemical resistance to a variety of fuels, oils and water. Part A and Part B have a nickel color. Owing to its versatile performance, KB 1031 ATFL-N is widely used in electronics, aerospace, electrical, semiconductor, microwave and various OEM applications. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
