Resinlab® EP1115 Clear Unfilled Epoxy Adhesive

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Resinlab® EP1115 Clear Unfilled Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. This product gives better water and temperature resistance than standard 5 minute epoxy. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side by side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 2 – 4 hours with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly. 30 minutes at 60°C t o 10 minutes at 100°C is typical. Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
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Available Properties

Specific Gravity, TM R050-16, Part B
Specific Gravity, TM R050-16, Mixed
Specific Gravity, TM R050-16, Part A
Water Absorption, TM R050-35
Viscosity, TM R050-12, Part A, RVT, #6, 2.5 rpm
Viscosity, TM R050-12, Mixed
Viscosity, TM R050-12, Part B, RVT, #6, 2.5 rpm
Hardness, Shore D, TM R050-17
Tensile Strength at Break, TM R050-36
Tensile Strength, Ultimate, TM R050-36
Tensile Strength, Yield, TM R050-36
Elongation at Break, TM R050-36
Tensile Modulus, TM R050-36
Compressive Yield Strength, TM R050-38
Compressive Strength, TM R050-38, Ultimate
Compressive Strength, TM R050-38, Break
Compressive Modulus, TM R050-38
Adhesive Bond Strength, TM R050-37, Lap shear; 2024 T3 Al Abraded / MEK Wipe
Volume Resistivity
Dielectric Constant
Dielectric Strength
CTE, linear, below Tg
CTE, linear, above Tg
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Glass Transition Temp, Tg, TM R050-25
Transmission, Visible, clear; thickness not quantified
Pot Life, TM R050-19, Mass: 50g

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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