Product Highlights:- Superior thermal conductivity
- Low coefficient of thermal expansion (CTE)
- Thixotropic Paste
- Superior dimensional stability
- Exceptional electrical insulation properties
- Capable of passing NASA low outgassing
Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. It offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive service temperature range of 4K (-269.15°C) to +200°C. It has outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, KB 1631 HTC-1 also offers excellent chemical resistance to a variety of acids, bases, fuels, oils and water. Part A and Part B have an off-white color. Owing to its Excellent performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
