Description: FM® 377 film adhesive is a 350°F (177°C) cure modified epoxy designed for continuous services at 350°F (177°C). FM 377 film adhesive provides outstanding durability in bonding metallic and non-metallic substrates, and in the co-cure or secondary bonding of composites structures. FM 377 adhesive exhibits excellent structural performance from -67°F to 350°F (-55°C to 177°C). FM 377 adhesive is manufactured as a supported film with a knit carrier or as an unsupported film. The unsupported version can be easily reticulated on honeycomb core or perforated metal. Features & Benefits: - Designed for bonding metallic, non-metallic and sandwich structures
- Excellent combination of high peel strength and high 350°F (177°C) shear strength
- Designed for continuous service at 350°F (177°C)
- Superior performance in co-cure or secondary bonding of composite structures
- Easily reticulated on core or perforated metal for nacelle bonding applications
- 30 days shop life at 75°F (24°C)
Applications: - Bonding metallic, non-metallic and sandwich structures
- Co-cure and secondary bonding of composite structures
Information provided by Cytec, subsequently acquired by Solvay. |