Epoxies, Etc 20-3035, Resin Low Density Epoxy Potting Compound

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Epoxies, Etc 20-3035, Resin Low Density Epoxy Potting Compound
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Description: 20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. In addition to the standard bulk packaging, 20-3035 can be supplied in the ready-to-use FreezeBond® premixed and frozen syinges for elimination of waste and consistent quality. Features: Low Dielectric Constant Low Coefficient of Thermal Expansion Low Shrinkage Low Density Excellent Moisture Resistance Information provided by Epoxies, Etc
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Physical Properties	Original Value	Comments

Viscosity	45000 cP	Mixed

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PFEPOX026 / 316703

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