Superior Flux Superior No. 315 No-Clean Soldering Flux

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RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Superior Flux Superior No. 315 No-Clean Soldering Flux
Categories:	Metal; Nonferrous Metal; Solder/Braze Alloy
Material Notes:	Eliminates the need for cleaning soldered boards. May be conformal coated without post cleaning. Can be used with lead free solder. Conforms to ANSI-J-STD-004, Type ORL0. Description: Superior No. 315 is specially formulated for wave soldering. This flux was designed for soldering high quality electronic printed circuit boards (PCBs), such as, through-hole, mixed technology, and surface mount assemblies while eliminating the need for a post cleaning operation. Superior No. 315 is formulated for foam and/or spray applications as supplied. Applications: WAVE SOLDERING-Superior No. 315 No-Clean Flux may be applied by foam, spray, or wave application. The optimum topside PCB preheat temperature recommendation is 200-240ºF/93-115ºC. Too low a preheat setting is indicated by post-solder residues on PCBs that look like water stains. Information provided by Superior Flux
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Physical Properties	Original Value	Comments

Specific Gravity	0.805 - 0.825 g/cc
Density	6.79 lb/gal
Solids Content	1.8 - 2.2 %

Chemical Properties	Original Value	Comments
Total Acid Number	16 - 22

Thermal Properties	Original Value	Comments
Flash Point	11.7 °C	TCC Method

Processing Properties	Original Value	Comments
Shelf Life	2.00 Month

Descriptive Properties
Color	Water white & clear

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NSFLUX051 / 185735

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