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A. Schulman BMC T15(GPS) General Purpose Molding Compound
Categories: Polymer; Thermoset; Polyester, TS; Polyester (Thermoset) - Rigid

Material Notes: BMC T15(GPS) is a high strength, low shrink general purpose molding compound. Due to the excellent flow and controlled reactivity, BMC T15(GPS) is well suited for injection, transfer or compression molding of intricate parts. Typical applications are circuit breakers, insulators, bobbins and electrical connectors.

Information provided by Bulk Molding Compounds, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.79 - 1.99 g/ccMolded
Linear Mold Shrinkage 0.0020 - 0.0030 in/in
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 30 - 35
Tensile Strength 5500 - 7500 psi
Flexural Strength 24000 - 28000 psi
Flexural Modulus 1700 - 1900 ksi
Compressive Strength 16000 - 20000 psi
Izod Impact, Notched 7.80 - 9.80 ft-lb/in
 
Electrical PropertiesOriginal ValueComments
Dielectric Strength 350 - 400 V/milshort time
Arc Resistance >= 183 sec
Comparative Tracking Index >= 500 V
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) >= 500 °F
Flammability, UL94 V-0
 
Processing PropertiesOriginal ValueComments
Processing Temperature 280 - 330 °F

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