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Master Bond adhesives

Oxygen-Free Copper with Mg, UNS C10850, H04 Temper, Strip
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Hard

Fabrication Properties: Excellent Suitability - Soldering; Brazing, Spot Weld; Butt Weld, Capacity for Being Hot Formed

Typical Uses: Electrical Connectors and Electrical Terminals

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.94 g/cc0.323 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Vickers 102
@Load 3.00 kg
102
@Load 6.62 lb
Tensile Strength 303 MPa44000 psi
 276 - 345 MPa40000 - 50000 psi
Tensile Strength, Yield 303 MPa44000 psi0.2% Offset
Elongation at Break 13 %13 %
Tensile Modulus 122 GPa17700 ksi
Modulus of Rigidity 46.58 GPa6756 ksiCalculated
Poissons Ratio 0.310.31
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000171 ohm-cm0.00000171 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.6 µm/m-°C
@Temperature 20.0 - 300 °C
9.80 µin/in-°F
@Temperature 68.0 - 572 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu >= 99.5 %>= 99.5 %
Magnesium, Mg 0.0020 - 0.013 %0.0020 - 0.013 %

References for this datasheet.

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MC10850x2 / 291481

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