Material Description: A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7.Information Provided by Epoxy Technology |