Product Highlights:- Superior thermal conductivity
- Excellent toughness
- Convenient 1:1 mix ratio
- First-rate thermal conductivity
- Exceptional electrical insulation properties
- Capable of passing NASA low outgassing
Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This epoxy system offers excellent toughness and superior peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive service temperature range of -70°C to +204°C. This adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers exceptionally high lap shear strength. TUF 1621 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers very good resistance to various chemicals, such as water, oils and fuels. Part A and Part B are gray/off-white in color. TUF 1621 AOHT is widely used in electronic, optoelectronic, vacuum, aerospace and related industries. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
