Parker Chomerics Tecknit TeckBond™-A Silver-Plated Aluminum-Filled Adhesive

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Parker Chomerics Tecknit TeckBond™-A Silver-Plated Aluminum-Filled Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Description: TECKBOND-A conductive system is a silicone based, two-component RTV, filled with silver-plated aluminum particles. After cure, the resultant bond or seal is flexible, resilient, and conductive. Application Information: TECKBOND-A conductive adhesive is recommended wherever a flexible bond is required in a metal to silicone gasket application, such as TECKNIT® CONSIL®-A Information provided by Chomerics
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Mechanical Properties	Metric	English	Comments

Shear Strength	>= 0.689 MPa	>= 99.9 psi	Cured; ASTM D1002
Peel Strength	>= 0.351 kN/m	>= 2.00 pli	Silicone Aluminum; Cured; ASTM D1876

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm	Cured; QAP-1017

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	302 °C	576 °F	Cured
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Cured
Shrinkage	<= 40 %	<= 40 %	Cured

Processing Properties	Metric	English	Comments
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F	followed by 24 hr @ 100°C
Shelf Life	9.00 Month	9.00 Month	Unopened Container

Descriptive Properties
Color	Beige
Consistency	Thick Paste
Filler	Ag/Al
Final Condition	Flexible
Mix Ratio	49:1
Number of Components	Two
Resin	Silicone
Volume	14 in³
Weight	16 oz

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PCHOME402 / 131112

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