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Chemically Resistant adhesives

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Park Aerospace Nelco® N4000-11 Multifunctional Epoxy Laminate and Prepreg
Categories: Polymer; Thermoset; Epoxy
Material Notes: The Nelco® N4000-11 is a CAF resistant, high Tg (175º C by DSC) multifunctional epoxy dielectric substrate. This material is formulated to provide the PWB manufacturer and OEM with vastly improved thermal, mechanical, and electrical performance in lead-free assembly and high layer count, sophisticated PWB designs.

Key Features and Benefits:

  • Tg >175ºC, thermal stability and moisture resistance
  • CAF Resistant
  • Low Z-axis expansion
  • Dicyandiamide (DICY) free, proprietary resin chemistry
  • Superior electrical properties
  • Optimized FR-4 processing

Applications/Qualifications:

  • Lead-Free Assembly Substrate
  • Large Format Backplanes
  • Tight Tolerance Via to Via Applications
  • High I / O Count BGA Substrates
  • Extreme Layer count Multilayers
  • Lead-Free DCA Applications
  • High Temperature Underhood Automotive
  • Telecommunications Infrastructure
  • Sophisticated Data Storage Applications
  • RoHS Compliant
  • Meets IPC-4101/28, /83, /98, /99 Specifications

Information provided by Park Electrochemical Corp.
Key Words: EP
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.96 g/cc50% Resin Content; Internal Method
Water Absorption 0.15 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Peel Strength 7.00 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 9.00 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 9.00 pliafter solder float; IPC-TM-650.2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+12 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+12 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 3.8
@Frequency 2.50e+9 Hz		Stripline; IPC-TM-650.2.5.5.5
 4.1
@Frequency 1e+9 Hz		RF Impedance; IPC-TM-650.2.5.5.9
 4.3
@Frequency 1e+6 Hz		TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength 1300 V/milIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 VIPC-TM-650.2.5.6
Dissipation Factor 0.016
@Frequency 1e+6 Hz		TFC/LCR Meter; IPC-TM-650.2.5.5.3
 0.020
@Frequency 2.50e+9 Hz		Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 124 secIPC-TM-650.2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.67 - 7.78 µin/in-°F
@Temperature -40.0 - 125 °C		X/Y; IPC-TM-650.2.4.41
 36.1 µin/in-°F
@Temperature 50.0 - 175 °C		Z-Axis Alpha 1; IPC-TM-650.2.4.41
 147 µin/in-°F
@Temperature 175 - 260 °C		Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 0.290 - 0.330 BTU/lb-°FASTM E1461-92
Thermal Conductivity 2.78 - 4.16 BTU-in/hr-ft²-°FASTM E1461-92
Glass Transition Temp, Tg 170 °CTMA; IPC-TM-650.2.4.24c
 >= 175 °CDSC; IPC-TM-650.2.4.25c
Decomposition Temperature 345 °C5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)0.8IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)30IPC-TM-650.2.4.24.1
Z Axis Expansion (%)3.250ºC to 260ºC; IPC-TM-650.2.4.41

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PPARK115 / 89387

Chemically Resistant adhesives




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