Tra-Con Tra-Bond 223F01 High Temperature Thermally Conductive Adhesive

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Tra-Con Tra-Bond 223F01 High Temperature Thermally Conductive Adhesive
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	TRA-BOND 223F01 is recommended for high temperature bonding applications where high thermal conductivity, long working life, low shrinkage, excellent chemical resistance and low exotherm properties are required. This material is easily mixed and handled at room temperature, however an elevated cure schedule is REQUIRED to develop the full properties of the material. TRA-BOND 223F01 provides a low coefficient of thermal expansion and excellent adhesion to most metals, glass and plastic substrates. Fully cured TRA-BOND 223F01 is a mechanically strong and durable electrical insulator, it provides outstanding resistance to water, weathering, salts, mild acids and many other organic and inorganic materials. This material complies with the requirements of NASA`s Outgassing Specification when tested according to ASTM E-595-90. Information provided by Tra-Con Inc.
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Physical Properties	Metric	English	Comments

Specific Gravity	2.23 g/cc	2.23 g/cc	Mixed
Water Absorption	0.20 %	0.20 %
Viscosity	128000 cP @Temperature 25.0 °C	128000 cP @Temperature 77.0 °F	Mixed (rv #7, 10 rpm)

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	92	92	3 hrs @ 125°C + 3 hrs @ 175°C
Adhesive Bond Strength	9.65 MPa	1400 psi	Lap shear, alum to alum, 3 hrs @ 125°C + 3 hrs @ 175°C

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+17 ohm-cm	1.00e+17 ohm-cm
Dielectric Constant	5.8 @Frequency 1e+6 Hz	5.8 @Frequency 1e+6 Hz
Dielectric Strength	18.1 kV/mm	460 kV/in
Dissipation Factor	0.010 @Frequency 1e+6 Hz	0.010 @Frequency 1e+6 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	38.0 µm/m-°C @Temperature 20.0 °C	21.1 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	1.34 W/m-K	9.30 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	230 °C	446 °F
Minimum Service Temperature, Air	-20.0 °C	-4.00 °F
Glass Transition Temp, Tg	133 °C	271 °F	Ultimate Tg

Processing Properties	Metric	English	Comments
Cure Time	360 min	6.00 hour	3 hrs @ 125°C + 3 hrs @ 175°C

Descriptive Properties
Color	Black
Mix Ratio, parts by weight	100/10		Resin/Hardener
Outgassing, NASA, %CVCM	0.01		3 hrs at each 125°C and 175°C
Outgassing, NASA, %TWL	0.22		3 hrs at each 125°C and 175°C
Thixotropic Index	2.2		1 rpm/10 rpm

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PTRAC067 / 70995

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