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Master Bond adhesives

LG Chemical LUPOY SG5009FA PC/ABS/PMMA, Halogen Free Flame Retardant  (discontinued **)
Categories: Polymer; Thermoplastic; ABS Polymer; Polycarbonate/ABS Alloy, Unreinforced; Acrylic (PMMA); Polycarbonate (PC)

Material Notes: Description: Injection Molding, PC/ABS, Halogen Free Flame Retardant, High Gloss, Anti-scratch

Application: IT&OA (Notebook PC housing)

CAS: 103598-77-2, 9003-56-9, 9011-14-7 and 181028-79-5

Information provided by LG Chemical

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.18 g/cc1.18 g/ccASTM D792
Maximum Moisture Content 0.0400.040Injection Molding
Linear Mold Shrinkage, Flow 0.0030 - 0.0050 cm/cm
@Thickness 3.20 mm
0.0030 - 0.0050 in/in
@Thickness 0.126 in
ASTM D955
Melt Flow 20 g/10 min
@Load 2.16 kg,
Temperature 250 °C
20 g/10 min
@Load 4.76 lb,
Temperature 482 °F
ASTM D1238
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 66.7 MPa
@Thickness 3.20 mm
9670 psi
@Thickness 0.126 in
50mm/min; ASTM D638
Flexural Yield Strength 103 MPa
@Thickness 3.20 mm
14900 psi
@Thickness 0.126 in
10mm/min; ASTM D790
Flexural Modulus 2.79 GPa
@Thickness 3.20 mm
405 ksi
@Thickness 0.126 in
10mm/min; ASTM D790
Izod Impact, Notched 0.834 J/cm
@Thickness 3.20 mm,
Temperature 23.0 °C
1.56 ft-lb/in
@Thickness 0.126 in,
Temperature 73.4 °F
ASTM D256
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 0.46 MPa (66 psi) 94.0 °C
@Thickness 6.40 mm
201 °F
@Thickness 0.252 in
Unannealed; ASTM D648
UL RTI, Electrical 80.0 °C176 °F
UL RTI, Mechanical with Impact 80.0 °C176 °F
UL RTI, Mechanical without Impact 80.0 °C176 °F
Flammability, UL94 V-0
@Thickness >=1.20 mm
V-0
@Thickness >=0.0472 in
 
Processing PropertiesMetricEnglishComments
Rear Barrel Temperature 230 - 270 °C446 - 518 °FInjection Molding
Middle Barrel Temperature 235 - 270 °C455 - 518 °FInjection Molding
Front Barrel Temperature 235 - 270 °C455 - 518 °FInjection Molding
Nozzle Temperature 235 - 270 °C455 - 518 °FInjection Molding
Melt Temperature 245 - 270 °C473 - 518 °FInjection Molding
Mold Temperature 90.0 - 120 °C194 - 248 °FInjection Molding
Drying Temperature 75.0 - 85.0 °C167 - 185 °FInjection Molding
Dry Time 3.00 - 4.00 hour3.00 - 4.00 hourInjection Molding
Back Pressure 0.981 - 1.96 MPa142 - 284 psiInjection Molding
Screw Speed 40 - 70 rpm40 - 70 rpmInjection Molding

**
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PLAY604 / 148614

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