Description: HexBond™ ST1480 is a modified epoxy film adhesive. This 180°C/356°F cure film adhesive is specially designed for bonding metal-to-metal and composite-to-composite structures. Its formulation, based on epoxy resin, provides high peel strength and toughness with high sheer strength. Features: - Excellent metal-to-metal peel strength and composite-to-composite bonding
- 180°C/356°F cure
- Service temperature from -55°C to 150°C (-67°F to 302°F)
- Excellent moisture resistance in high humidity environments
- Available in a wide range of film thicknesses
Applications: - Metal-to-metal bonding
- Sandwich construction
- Composite-to-composite bonding
Information provided by Hexcel Corporation. |