UBE UPILEX®-SGA 50SGA Polyimide

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UBE UPILEX®-SGA 50SGA Polyimide
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	UPILEX®-SGA is a polyimide film having improved adhesion properties created by a special process to both sides of the UPILEX®-S. It is suitable for sputtering or plating processes because of high surface adhesion. It offers a flexible base for high-performance electronic circuits. In addition, it can also be used as an adhesive tape base material for LOC packaging. In sputtering or plating, a flexible base for electronic circuits that does not use any adhesives can be obtained. Peel strength is high, surface smoothness is very high. Superior mechanical property, with low water absorption, excellent dimensional stability and high heat resistance comparable to UPILEX®-S. Information provided by UBE Industries, LTD
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Physical Properties	Metric	English	Comments

Density	1.47 g/cc	0.0531 lb/in³	ASTM D1505
Water Absorption	1.4 %	1.4 %	ASTM D570

Mechanical Properties	Metric	English	Comments
Tensile Strength	490 MPa	71100 psi	ASTM D882
Elongation at Break	45 %	45 %	ASTM D882
Tensile Modulus	9.70 GPa	1410 ksi	ASTM D882

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm	>= 1.00e+14 ohm-cm	DC 100V; ASTM D257
Surface Resistance	>= 1.00e+16 ohm	>= 1.00e+16 ohm	DC 100V; ASTM D257
Dielectric Strength	10.6 kV/mm	269 kV/in	ASTM D149

Thermal Properties	Metric	English	Comments
CTE, linear	14.0 µm/m-°C @Temperature 50.0 - 200 °C	7.78 µin/in-°F @Temperature 122 - 392 °F	Fine linear dilatometer
Shrinkage	0.060 % @Temperature 200 °C, Time 7200 sec	0.060 % @Temperature 392 °F, Time 2.00 hour	heat; ASTM D1204

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PUBD9854 / 287317

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