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Encom Polymers EnFone 20GF PSU, Medium Molecular Weight Molding Grade
Categories:
Polymer
;
Thermoplastic
;
Polysulfone (PSU)
Material Notes:
Appearance: Natural
Processing Methods: Injection Molding
Applications: Automotive, Industrial
Information provided by EnCom Polymers
Vendors:
No vendors are listed for this material. Please
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Physical Properties
Original Value
Comments
Specific Gravity
1.40
g/cc
ASTM D792
Maximum Moisture Content
0.020
Linear Mold Shrinkage, Flow
0.076
in/in
@Thickness 3.20 mm
ASTM D955
Melt Flow
6.0
g/10 min
@Load 2.16 kg,
Temperature 343 °C
ASTM D1238
Mechanical Properties
Original Value
Comments
Tensile Strength, Yield
93.0
MPa
ASTM D638
Elongation at Break
3.0 %
ASTM D638
Tensile Modulus
5655
MPa
ASTM D638
Flexural Strength
143
MPa
ASTM D790
Flexural Modulus
5172
MPa
ASTM D790
Izod Impact, Notched
53.0
J/m
ASTM D256
Thermal Properties
Original Value
Comments
Deflection Temperature at 1.8 MPa (264 psi)
174
°C
ASTM D648
Flammability, UL94
HB
@Thickness 3.17 mm
Processing Properties
Original Value
Comments
Rear Barrel Temperature
620
-
670
°F
Middle Barrel Temperature
630
-
680
°F
Front Barrel Temperature
640
-
690
°F
Nozzle Temperature
650
-
700
°F
Melt Temperature
650
-
750
°F
Mold Temperature
275
-
350
°F
Drying Temperature
300
-
325
°F
Dry Time
4.00
hour
<=
7.00
hour
Back Pressure
0.000
-
50.0
psi
Shot Size
25 - 75 %
Vent Depth
0.00150
-
0.00300
in
Screw Speed
50
-
100
rpm
Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's
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regarding this information.
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PENCOM210 / 266224
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