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Master Bond adhesives

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Encom Polymers EnFone 20GF PSU, Medium Molecular Weight Molding Grade
Categories: Polymer; Thermoplastic; Polysulfone (PSU)

Material Notes: Appearance: Natural

Processing Methods: Injection Molding

Applications: Automotive, Industrial

Information provided by EnCom Polymers

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.40 g/ccASTM D792
Maximum Moisture Content 0.020
Linear Mold Shrinkage, Flow 0.076 in/in
@Thickness 3.20 mm
ASTM D955
Melt Flow 6.0 g/10 min
@Load 2.16 kg,
Temperature 343 °C
ASTM D1238
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 93.0 MPaASTM D638
Elongation at Break 3.0 %ASTM D638
Tensile Modulus 5655 MPaASTM D638
Flexural Strength 143 MPaASTM D790
Flexural Modulus 5172 MPaASTM D790
Izod Impact, Notched 53.0 J/mASTM D256
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) 174 °CASTM D648
Flammability, UL94 HB
@Thickness 3.17 mm
 
Processing PropertiesOriginal ValueComments
Rear Barrel Temperature 620 - 670 °F
Middle Barrel Temperature 630 - 680 °F
Front Barrel Temperature 640 - 690 °F
Nozzle Temperature 650 - 700 °F
Melt Temperature 650 - 750 °F
Mold Temperature 275 - 350 °F
Drying Temperature 300 - 325 °F
Dry Time 4.00 hour
 <= 7.00 hour
Back Pressure 0.000 - 50.0 psi
Shot Size 25 - 75 %
Vent Depth 0.00150 - 0.00300 in
Screw Speed 50 - 100 rpm

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PENCOM210 / 266224

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