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Master Bond adhesives

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Alcoloy Copper, UNS C68800, OS015 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Nominal Grain Size 0.015 mm

Fabrication Properties: Excellent Suitability – Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Spot Weld, Seam Weld, Butt Weld; Fair Suitability – Soldering, Brazing

Common Fabrication Processes: Blanking; Drawing; Forming and Bending; Shearing and Stamping

Typical uses: Connectors; Contacts; Electrical Connectors; Plug Receptacles; Relays; Springs; Switches; Terminals; Drawn Parts

Applicable Specifications: Bar – Rolled ASTM B592; Plate - ASTM B592; Sheet - ASTM B592; Strip – ASTM B888/B88, ASTM B592

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Physical PropertiesOriginal ValueComments
Density 0.296 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 81
@Thickness 1.02 mm
Hardness, Rockwell 30T 71
@Thickness 1.02 mm
Tensile Strength 82.0 ksi
@Thickness 1.02 mm
Tensile Strength, Yield 54.0 ksi
@Thickness 1.02 mm
0.5% Ext
 55.0 ksi
@Thickness 1.02 mm
0.2% Offset
Elongation at Break 36 %
@Thickness 1.02 mm
Tensile Modulus 16800 ksi
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000210 ohm-cm8.2% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.1 µin/in-°F
@Temperature 20.0 - 300 °C
Specific Heat Capacity 0.0900 BTU/lb-°F
Thermal Conductivity 23.0 BTU-in/hr-ft²-°F
Melting Point 1740 - 1765 °F
Solidus 1740 °F
Liquidus 1765 °F
Annealing Point 750 - 1100 °F
 
Component Elements PropertiesOriginal ValueComments
Aluminum, Al 3.0 - 3.8 %
Cobalt, Co 0.25 - 0.55 %
Copper, Cu 71.3 - 75.5 %As Balance
Iron, Fe <= 0.20 %
Lead, Pb <= 0.050 %
Zinc, Zn 21.3 - 24.1 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC68800x1 / 293085

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