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Master Bond adhesives

CP-Polymer-Technik Wellamid® 6000/50 HWUVCP Nylon 6, Impact Modified Until 0°C, UV Stabilized, Heat Stabilized, Conditioned
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 6 (PA6); Nylon 6, Impact Grade

Material Notes: Information provided by CP-Polymer-Technik GmbH & Co. KG

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.11 g/cc0.0401 lb/in³ISO 1183
Moisture Absorption at Equilibrium 2.5 - 3.3 %2.5 - 3.3 %23°C/50%RH, Starting when dry; DIN 53495
Linear Mold Shrinkage 0.0080 - 0.012 cm/cm
@Thickness 4.00 mm
0.0080 - 0.012 in/in
@Thickness 0.157 in
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 40.0 MPa5800 psi50 mm/min; ISO 527
Elongation at Break >= 50 %>= 50 %50 mm/min; ISO 527
Elongation at Yield 25 %25 %50 mm/min; ISO 527
Tensile Modulus 1.00 GPa145 ksiISO 527
Charpy Impact Unnotched NB
@Temperature 23.0 °C
NB
@Temperature 73.4 °F
ISO 179
Charpy Impact, Notched 3.00 J/cm²
@Temperature 23.0 °C
14.3 ft-lb/in²
@Temperature 73.4 °F
ISO 179
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+12 ohm-cm1.00e+12 ohm-cmIEC 93
Surface Resistance 1.00e+10 ohm1.00e+10 ohmISO 3915
Dielectric Constant 7.0
@Frequency 1e+6 Hz
7.0
@Frequency 1e+6 Hz
IEC 250
Dielectric Strength 35.0 kV/mm889 kV/inIEC 243-1
Dielectric Loss Index 0.30
@Frequency 1e+6 Hz
0.30
@Frequency 1e+6 Hz
IEC 250
 
Thermal PropertiesMetricEnglishComments
Melting Point 215 °C419 °FKofler
 
Processing PropertiesMetricEnglishComments
Melt Temperature 245 - 260 °C473 - 500 °F
Mold Temperature 40.0 - 80.0 °C104 - 176 °F
 
Descriptive Properties
Back PressureLow
Holding PressureHigh
Injection SpeedMedium
Screw SpeedMedium

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