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Master Bond adhesives

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Envalior ForTii® Eco E11 PPA-GF30 FR(40) PA4T High Temperature Polyamide
Categories: Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 40% Glass Fiber Reinforced

Material Notes: ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.

ForTii® Eco E11 has an excellent balance in flow, toughness and stiffness with superior processing performance for injection molding. It has improved toughness and is suitable for SMT processes.

Features: Good or high flow, phosphorous free. 30% glass reinforced. Processing: Injection molding.

Former DSM Engineering Plastics product line is now with Envalior.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.45 g/ccDry; ISO 1183
Moisture Absorption 1.40 %Dry; Sim. to ISO 62
Linear Mold Shrinkage, Flow 0.0035 cm/cmDry; ISO 294-4
Linear Mold Shrinkage, Transverse 0.012 cm/cmDry; ISO 294-4
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 55.0 MPa
@Temperature 160 °C
ISO 527-1/-2
 60.0 MPa
@Temperature 140 °C
ISO 527-1/-2
 70.0 MPa
@Temperature 120 °C
Dry; ISO 527-1/-2
 85.0 MPa
@Temperature 100 °C
Dry; ISO 527-1/-2
 110 MPa
@Temperature 80.0 °C
Dry; ISO 527-1/-2
 145 MPa
@Temperature 23.0 °C
Cond; ISO 527-1/-2
 155 MPa
@Temperature 23.0 °C
Dry; ISO 527-1/-2
 180 MPa
@Temperature -40.0 °C
Dry; ISO 527-1/-2
Elongation at Break 2.3 %
@Temperature 23.0 °C
Dry; ISO 527-1/-2
 2.4 %
@Temperature 23.0 °C
Cond; ISO 527-1/-2
 2.4 %
@Temperature -40.0 °C
Dry; ISO 527-1/-2
 2.8 %
@Temperature 80.0 °C
Dry; ISO 527-1/-2
 3.8 %
@Temperature 100 °C
Dry; ISO 527-1/-2
 4.5 %
@Temperature 120 °C
Dry; ISO 527-1/-2
 4.5 %
@Temperature 140 °C
ISO 527-1/-2
 4.5 %
@Temperature 160 °C
ISO 527-1/-2
Tensile Modulus 4200 MPa
@Temperature 160 °C
Dry; ISO 527-1/-2
 4700 MPa
@Temperature 140 °C
Dry; ISO 527-1/-2
 5500 MPa
@Temperature 120 °C
Dry; ISO 527-1/-2
 7000 MPa
@Temperature 100 °C
Dry; ISO 527-1/-2
 9000 MPa
@Temperature 80.0 °C
Dry; ISO 527-1/-2
 11000 MPa
@Temperature 23.0 °C
Cond; ISO 527-1/-2
 11500 MPa
@Temperature 23.0 °C
Dry; ISO 527-1/-2
 12000 MPa
@Temperature -40.0 °C
Dry; ISO 527-1/-2
Flexural Strength 230 MPaDry; ISO 178
Flexural Modulus 10000 MPaDry; ISO 178
Charpy Impact Unnotched 55.0 kJ/m²
@Temperature 23.0 °C
Dry; ISO 179/1eU
Charpy Impact, Notched 8.00 kJ/m²
@Temperature 23.0 °C
Dry; ISO 179/1eA
 8.00 kJ/m²
@Temperature 23.0 °C
Cond; ISO 179/1eA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cmDry; IEC 60093
 >= 1.00e+13 ohm-cmCond; IEC 60093
Dielectric Constant 3.7
@Frequency 1e+9 Hz
Dry; IEC 60250
 3.9
@Frequency 1e+10 Hz
Cond; IEC 60250
Dielectric Strength 33.0 kV/mmDry; IEC 60243-1
Comparative Tracking Index 600 VIEC 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear 70.0 µm/m-°CDry; ISO 11359-1/-2
CTE, linear, Parallel to Flow 20.0 µm/m-°Cdry; ISO 11359-1/-2
Melting Point 325 °C10°C/min. Dry; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi) 275 °CDry; ISO 75-1/-2
UL RTI, Electrical 150 °C
@Thickness 0.750 mm
UL746B
Flammability, UL94 V-0
@Thickness 1.50 mm
IEC 60695-11-10
 V-0
@Thickness 3.00 mm
IEC 60695-11-10

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PDSM7905 / 291341

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