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Master Bond adhesives

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Master Bond EP101HTX-3 One Component Thermally Stable Epoxy System
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes: Master Bond EP101HTX-3 is a one component, high performance epoxy resin system with a long pot life at room temperature. It features high thermal stability, electrical insulation properties and excellent thermal shock resistance. EP101HTX-3 is suitable for coating, sealing, potting, encapsulation and impregnation applications.
Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Water Absorption <= 0.50 %
@Temperature 23.9 °C,
Time 605000 sec		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 <= 0.50 %
@Temperature 23.9 °C,
Time 605000 sec		Cured 8 hrs @ 300°F
Moisture Vapor Transmission <= 57.6 cc-mil/100 in²-24hr-atm
@Temperature 40.0 °C		RH 95%, Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 <= 57.6 cc-mil/100 in²-24hr-atm
@Temperature 40.0 °C		RH 95%, Cured 8 hrs @ 300°F
Viscosity 1000 - 1500 cP
@Temperature 23.0 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 41Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 43Cured 8 hrs @ 300°F
Tensile Strength 11600 psiCured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 12100 psiCured 8 hrs @ 300°F
Elongation at Break 3.1 %Cured 8 hrs @ 300°F
 3.4 %Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
Flexural Strength 17200 psiCured 8 hrs @ 300°F
 17500 psiCured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
Compressive Strength 17200 psiCured 8 hrs @ 300°F
 17300 psiCured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+9 ohm-cm
@Temperature 200 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 >= 1.00e+10 ohm-cm
@Temperature 200 °C		Cured 8 hrs @ 300°F
 3.00e+11 ohm-cm
@Temperature 150 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.60e+11 ohm-cm
@Temperature 150 °C		Cured 8 hrs @ 300°F
 >= 3.00e+12 ohm-cm
@Temperature 100 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 >= 3.00e+12 ohm-cm
@Temperature 100 °C		Cured 8 hrs @ 300°F
 >= 2.00e+14 ohm-cm
@Temperature 25.0 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 >= 3.00e+14 ohm-cm
@Temperature 25.0 °C		Cured 8 hrs @ 300°F
Dielectric Constant 2.94
@Frequency 1e+6 Hz,
Temperature 100 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 2.99
@Frequency 1e+6 Hz,
Temperature 25.0 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.0
@Frequency 1000 Hz,
Temperature 100 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.01
@Frequency 1e+6 Hz,
Temperature 25.0 °C		Cured 8 hrs @ 300°F
 3.24
@Frequency 1000 Hz,
Temperature 25.0 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.25
@Frequency 60 Hz,
Temperature 25.0 °C		Cured 8 hrs @ 300°F
 3.28
@Frequency 1000 Hz,
Temperature 150 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.28
@Frequency 1000 Hz,
Temperature 25.0 °C		Cured 8 hrs @ 300°F
 3.31
@Frequency 1e+6 Hz,
Temperature 150 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.34
@Frequency 60 Hz,
Temperature 25.0 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.37
@Frequency 60 Hz,
Temperature 100 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.38
@Frequency 60 Hz,
Temperature 100 °C		Cured 8 hrs @ 300°F
 3.7
@Frequency 60 Hz,
Temperature 150 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 3.74
@Frequency 60 Hz,
Temperature 150 °C		Cured 8 hrs @ 300°F
Dissipation Factor 0.013
@Frequency 1e+6 Hz,
Temperature 100 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 0.013
@Frequency 1e+6 Hz,
Temperature 150 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 0.013
@Frequency 1e+6 Hz,
Temperature 150 °C		Cured 8 hrs @ 300°F
 0.014
@Frequency 1e+6 Hz,
Temperature 100 °C		Cured 8 hrs @ 300°F
 0.020
@Frequency 1e+6 Hz,
Temperature 25.0 °C		Cured 8 hrs @ 300°F
 0.021
@Frequency 1e+6 Hz,
Temperature 25.0 °C		Cured 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 400 - 450 °Flong term
 475 - 500 °Fshort term
Minimum Service Temperature, Air -60.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 6.00 hourAt 250°F plus 6 to 10 hrs at 300°F
 
Descriptive Properties
Moisture vapor transmission<0.04 gm/ft2/24 hrs/inat 40°C, RH 95%, 3-5 hrs@ 250°F plus 5 hrs @ 300°F
 <0.04 gm/ft2/24 hrs/inat 40°C, RH 95%, 8 hrs @ 300°F

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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PMASTB266 / 132863




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