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Master Bond adhesives

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Morgan Advanced Ceramics Morbond AL Thermal Ceramic
Categories: Ceramic; Oxide

Material Notes: Bauxite raw material base. Chemical bond. Morbond AL is a two component system that forms a rapid setting, easily placed castable on mixing, which can be brought quickly into service. It is a bauxite based composition specifically developed for aluminium contact applications, exhibiting excellent resistance to corundum growth and metal penetration. Applications: Suitable repair material for metal contact areas in aluminium re-heat and holding furnaces.

Information provided by Morgan Advanced Materials

Key Words: Thermal Ceramics
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Bulk Density 2.65 g/ccdried to 110°C
Grain Size <= 4000 µm
 
Mechanical PropertiesOriginal ValueComments
Compressive Strength 30.0 MPa
@Treatment Temp. 110 °C
Cold Crushing Strength
 30.0 MPa
@Treatment Temp. 815 °C
Cold Crushing Strength
 30.0 MPa
@Treatment Temp. 1000 °C
Cold Crushing Strength
 30.0 MPa
@Treatment Temp. 1450 °C
Cold Crushing Strength
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 2.42 W/m-K
@Temperature 600 °C
Maximum Service Temperature, Air <= 1450 °C
Shrinkage 0.10 %
@Treatment Temp. 815 °C
 0.10 %
@Treatment Temp. 1000 °C
 1.0 %
@Treatment Temp. 1450 °C
 
Component Elements PropertiesOriginal ValueComments
Al2O3 87 %
CaO 1.6 %
Fe2O3 0.60 %
K2O+Na2O 0.20 %Na2O+ K2O
MgO 0.10 %
P2O5 5.4 %
SiO2 3.0 %
TiO2 1.6 %
 
Descriptive Properties
Net Material Required (kg/m³)2650
Water Additionaccelerator, 1 bottle, 25 kg bag weight.

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CMORF6266 / 203050

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