MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Elmet Technologies

(Viewing data as-entered. Click here to return)
Lord Adhesives Thermoset™ ME-525 Underfill Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset™ ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.

All information provided by Lord.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.70 g/cc
Water Absorption <= 0.50 %
Brookfield Viscosity 6000 cP
@Temperature 25.0 °C
Spindle CP40 @ 5rpm
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 4.00 GPaStorage
Shear Strength 9425 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cm
@Temperature 25.0 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 23.0 µm/m-°CAlpha 1
 85.0 µm/m-°CAlpha 2
Glass Transition Temp, Tg 120 °CTMA
 
Processing PropertiesOriginal ValueComments
Cure Time 15.0 min
@Temperature 165 °C
 30.0 min
@Temperature 150 °C
Pot Life 2160 min
@Temperature 25.0 °C
Gel Time 5.00 min
@Temperature 150 °C
Shelf Life 6.00 Month
@Temperature -40.0 °C
 
Component Elements PropertiesOriginal ValueComments
Potassium, K <= 0.00010 %
Sodium, Na <= 0.00050 %
 
Descriptive Properties
AppearanceBlack
Chloride (%)< 0.001
ConsistencyLow-Viscosity Liquid

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Henkel Loctite® 3563 Epoxy Snap Cure Underfill
Huntsman Araldite GY 281 Bisphenol F Epoxy Resin
Overview of materials for Epoxy Adhesive, Flexible
Solvay BR® 4535A Paste Adhesive
Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material

PLORD097 / 86105

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at info@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2025 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.