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Master Bond adhesives

CP-Polymer-Technik Wellamid® 6000/505 GS 30 HWCP 30% Impact Modified Glass Sphere Filled Nylon 6, Heat Stabilized, Conditioned
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 6 (PA6); Nylon 6, Glass Filled, Impact Grade

Material Notes: Information provided by CP-Polymer-Technik GmbH & Co. KG

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.32 g/cc0.0477 lb/in³ISO 1183
Moisture Absorption at Equilibrium 1.5 - 2.0 %1.5 - 2.0 %23°C/50%RH, Starting when dry; DIN 53495
Linear Mold Shrinkage 0.0080 - 0.010 cm/cm
@Thickness 4.00 mm
0.0080 - 0.010 in/in
@Thickness 0.157 in
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 40.0 MPa5800 psi5 mm/min; ISO 527
Elongation at Break 28 %28 %5 mm/min; ISO 527
Tensile Modulus 1.70 GPa247 ksiISO 527
Charpy Impact Unnotched NB
@Temperature 23.0 °C
NB
@Temperature 73.4 °F
ISO 179
Charpy Impact, Notched 2.00 J/cm²
@Temperature 23.0 °C
9.52 ft-lb/in²
@Temperature 73.4 °F
ISO 179
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+12 ohm-cm1.00e+12 ohm-cmIEC 93
Surface Resistance 1.00e+10 ohm1.00e+10 ohmISO 3915
Dielectric Constant 6.0
@Frequency 1e+6 Hz
6.0
@Frequency 1e+6 Hz
IEC 250
Dielectric Strength 35.0 kV/mm889 kV/inIEC 243-1
Dielectric Loss Index 0.20
@Frequency 1e+6 Hz
0.20
@Frequency 1e+6 Hz
IEC 250
 
Thermal PropertiesMetricEnglishComments
Melting Point 215 °C419 °FKofler
 
Processing PropertiesMetricEnglishComments
Melt Temperature 250 - 270 °C482 - 518 °F
Mold Temperature 60.0 - 90.0 °C140 - 194 °F
 
Descriptive Properties
Back PressureLow
Holding PressureHigh
Injection SpeedMedium
Screw SpeedHigh

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PWELL043 / 72500

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