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ITW Devcon® DEVWELD 531 Methacrylate Adhesive
Categories: Polymer; Adhesive; Thermoset; Methacrylate; Methacrylate Adhesive

Material Notes: Devweld 531 is a two-part 1:1 ratio methacrylate adhesive designed for structural bonding of thermoplastic, metal and composite assemblies. Devweld 531 is particularly well suited for bonding thermoplastic materials and combines high strength and stiffness with the ability to adhere difficult-to-bond materials.

FEATURES: • Excellent shear, peel and impact strength • Non-sagging • Will fill gaps of up to 4mm • Excellent load bearing qualities • Resistant to weathering and humidity • Specifically designed for difficult-to-bond substrates • Room temperature cure • No surface preparation • 100% reactive.

Information provided by ITW Performance Polymers.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 8.10 lb/galPart B, Uncured
 8.35 lb/galMixed, uncured
 8.60 lb/galPart A, Uncured
Viscosity 40000 - 60000 cPPart A
 40000 - 60000 cPPart B
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 3920 - 4500 psi
Elongation at Break 5.0 - 15 %
Adhesive Bond Strength 20.0 - 24.0 MPaLap Shear; Cured. GBS
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 121 °F
Minimum Service Temperature, Air -55.0 °F
Flash Point 9.00 °FUncured
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hourFull
Pot Life 15.0 - 18.0 min
 
Descriptive Properties
Chemical/Solvent ResistanceAcids and bases: excellent
 Hydrocarbons: excellent
 salt solution: excellent
Coloroff whitePart A
 yellowPart B
Fixture Time (mins)30 to 35uncured
Gap Filling (in)0.0394 to 0.157
Mix Ratio by volume1:1Part A: Part B
Mix Ratio by weight1:1Part A: Part B

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PITWD9233 / 239742

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