Product Highlights:- Thermally conductive
- Lower exotherm while curing
- Expeditious cures at 80°C or higher
- Superior dimensional stability
- Exceptional electrical insulation properties
- Unlimited working life at room temperature
Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature. Unlike other one component epoxies, this product can be cured at temperatures as low as 80°C. Although superlative properties are obtained with higher temperature cures, good mechanical strength properties and dimensional stability are furnished by 80°C cures as well. KB 1613 R80 offers an extensive service temperature range of -70°C to +180°C. This product’s exquisite flow properties and lower exotherm makes it ideal for use in potting and encapsulation applications for 1/2” thicknesses and beyond. KB 1613 R80 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1613 R80 also offers excellent chemical resistance to a variety of fuels, oils and water. It has a tan - yellow color. With a combination of Excellent performance, ease of use and speedy cures at convenient temperatures, KB 1613 R80 is widely used in electronics, aerospace, major OEM and similar applications. Typical Applications: - Bonding
- Coating
- Sealing
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
