MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Ensinger PEI

(Viewing data as-entered. Click here to return)
Bakelite® Keripol® RZ 1141 Polyester Molding Compound, High Surface Quality  (discontinued **)
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Polyester, TS; Thermoset Polyester Glass Filled BMC

Material Notes: Polyester molding compound, organically/inorganically filled, glass fiber reinforced, styrene free, very slight post shrinkage, processing shrinkage as for phenolic molding compounds, high surface quality.

Application areas: Oven strips.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.88 g/ccISO 1183
Apparent Bulk Density 0.810 g/ccISO 60
Linear Mold Shrinkage, Flow 0.0055 cm/cmCompression molding; ISO 2577
 
Mechanical PropertiesOriginal ValueComments
Flexural Strength 95.0 MPa2 mm/min; ISO 178
Flexural Modulus 9.50 GPaISO 178
Charpy Impact Unnotched 0.750 J/cm²
@Temperature 23.0 °C
ISO 179-1/2 eU
Charpy Impact, Notched 0.160 J/cm²
@Temperature 23.0 °C
ISO 179-1/2 eA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmIEC 60093
Surface Resistance 1.00e+12 ohmIEC 60093
Dielectric Constant 6.0
@Frequency 100 Hz
IEC 60250
Dielectric Strength 25.0 kV/mm
@Thickness 1.00 mm
IEC 60243-P1
Dissipation Factor 0.017
@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 600 VTest liquid A; IEC 60112
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 8.0 MPa 95.0 °CISO 75-2
Shrinkage 0.20 %
@Temperature 110 °C
Compression molding; ISO 2577
 
Descriptive Properties
Moisture Absorption80 mgISO 62, 24 hours at 23°C

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Overview of materials for Phenolic; Unreinforced; Molded
Bakelite® EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage

PBAKE058 / 27092

Proto3000 – 3D Engineering Solutions

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.