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Master Bond adhesives

Parker Chomerics THERMATTACH® T421 Thermally Conductive BGA Assembly Tape  (discontinued **)
Categories: Polymer; Adhesive

Material Notes: THERMATTACH have been designed to provide a high performance bond in the assembly of EBGA and TBGA semiconductor packages. Their thermally conductive filler ensures superior package performance when used to bond the flex or laminate substrate to stiffeners and heat spreaders.

Information provided by Chomerics

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.50 g/cc1.50 g/ccASTM D792
Thickness 50.8 microns2.00 milASTM D374
 
Mechanical PropertiesMetricEnglishComments
Adhesive Bond Strength 1.03 MPa150 psiDie Shear Adhesion (CTP No.54)
Peel Strength >= 0.600 kN/m>= 3.42 pliASTM D1000
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm>= 1.00e+14 ohm-cmASTM D257
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 0.460 W/m-K3.19 BTU-in/hr-ft²-°FASTM D5470
 
Descriptive Properties
BinderAcrylic
FillerAluminum Oxide
Tack Adhesion, gm (Polyken PSTC)500

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PCHOME004 / 28226

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