Tra-Con Tra-Bond F113SC High Tg Fiber Optic Epoxy Adhesive

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Tra-Con Tra-Bond F113SC High Tg Fiber Optic Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	TRA-BOND F113SC is a room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors. It has also been used for bonding LED displays, lenses and other optical components. TRA-BOND F113SC provides both high bond strength as well as low stress connections with no pistoning. This two part system can be cured overnight at room temperature or as quickly as 15 minutes at 90°C and is provided in a dark blue color to allow for easy polishing. Sufficient cure is developed for polishing connectors in 15 minutes at 65°C, when higher cure temperatures are possible. TRA-BOND F113SC will complete its cure at room temperature with no pistoning. Information provided by Tra-Con Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.10 g/cc	Mixed
Volatile Organic Compounds (VOC) Content	1.91 g/l
Water Absorption	0.98 %
Viscosity	1800 cP @Temperature 25.0 °C	After mixing

Mechanical Properties	Original Value	Comments
Hardness, Shore D	83
Adhesive Bond Strength	2700 psi	Lap shear, alum to alum, 24 hrs @ 25°C
	3900 psi	Lap shear, alum to alum, 1 hr @ 65°C

Thermal Properties	Original Value	Comments
CTE, linear	75.7 µm/m-°C	Below Tg
	191 µm/m-°C	Above Tg
Maximum Service Temperature, Air	120 °C
Minimum Service Temperature, Air	-60.0 °C
Glass Transition Temp, Tg	95.0 °C	Ultimate Tg

Optical Properties	Original Value	Comments
Refractive Index	1.52

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 65.0 °C
	15.0 min @Temperature 90.0 °C	1 drop applications
	18.0 hour @Temperature 25.0 °C
Pot Life	35 min	25 grams
Working Life	1.00 hour	25 grams

Descriptive Properties
Color	Clear	Resin
	Dark Blue	Hardener/Mixed
Mix Ratio, parts by weight	100/30	Resin/Hardener
Thixotropic Index	1

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PTRAC226 / 71154

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