Epoxy Technology EPO-TEK® E2036 Epoxy

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Epoxy Technology EPO-TEK® E2036 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level, flex circuitry, or optical and medical devices. It can be used for resisting thermal cycles, high vibration applications or resisting PCB drop tests. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	2.81 g/cc	2.81 g/cc	Part A
	3.52 g/cc	3.52 g/cc	Part B
Particle Size	<= 20 µm	<= 20 µm
Viscosity	10000 - 20000 cP @Temperature 23.0 °C	10000 - 20000 cP @Temperature 73.4 °F	20 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	1.0 ppm	1.0 ppm
Ionic Impurities - K (Potassium)	8.0 ppm	8.0 ppm
Ionic Impurities - Cl (Chloride)	422 ppm	422 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75
Tensile Modulus	4.40 GPa	638 ksi	Storage
Shear Strength	10.29 MPa	1492 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 0.00030 ohm-cm	>= 0.00030 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
	178 µm/m-°C	98.9 µin/in-°F	Above Tg
Thermal Conductivity	1.53 W/m-K	10.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	444 °C	831 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F
Pot Life	4320 min	4320 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Silver		Part A
	Silver		Part B
Consistency	Soft, smooth paste
Ionic Impurities NH₄	159 ppm
Mix Ratio by Weight	3:1
Number of Components	Two
Thixotropic Index	3.95
Weight Loss	0.13%		200°C
	0.32%		250°C
	0.65%		300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT007 / 141045

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