MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Master Bond adhesives

(Viewing data as-entered. Click here to return)
Parker Chomerics Tecknit Teckfip™ FIP-E Formed in Place Conductive Elastomer
Categories: Polymer; Thermoset; Rubber or Thermoset Elastomer (TSE)

Material Notes: Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value. The material is also available as a heat cure compound (HC-FIP-E)

Information provided by Chomerics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.53 - 2.07 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 53 - 75
Tensile Strength >= 273 psi
Elongation at Break 71 %
Peel Strength >= 16.75 kN/mTypical
Compression Set 30 %Recommended
 13 %
@Temperature 70.0 °C,
Time 79200 sec
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.0070 ohm-cm
Surface Resistance <= 0.012 ohm
 <= 0.012 ohm
@Temperature 85.0 °C,
Time 605000 sec
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 125 °C
Minimum Service Temperature, Air -55.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time <= 24.0 hour
Tack-Free Time >= 0.200 hour
Shelf Life 1.00 MonthSyringe
 6.00 MonthCartridge
 
Descriptive Properties
ColorIvory
FillerSilver/Glass Small Particle

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
NuSil EPM-2463 Silicone, Thermal Interface Material (TIM): Electrically Conductive
NuSil R-2634 Silicone, Electrically Conductive
P & P Technology EC-S Pure Silver Loaded Silicone
Parker Chomerics CHO-SEAL 1221 Conductive Elastomer
Parker Chomerics Tecknit Consil®-R 855 Pure Silver-Filled Silicone Elastomer

PCHOME359 / 131069

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.