| Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. Advantages & Application Notes: - It is a snap cure version of EPO-TEK® H20E, designed for snap cure at 140°C and <15 minute cure at 120°C.
- Strengths include dispensable rheology and a long pot life.
- Suggested Applications:
- Semiconductor: die-attaching IC’s onto Cu plated lead-frame yielding semiconductor plastic package formats.
- PCB: solder replacement adhesive, electrical bridge of Au, Ag and AgPd electrode pads onto Au- or Cu-plated PCBs.
- Photovoltaics:
- Electrically conductive stringing of thin film, organic and crystalline Si solar cells.
- Compatible with SnCu and AgCu metalized solar ribbons, and TCO substrates such as ITO, ZnO and SnO.
- Versatility in ribbon bonding geometries, such as dotted or continuous line.
- In-line/in-situ curing processes in <1 minute at 140°C can be achieved.
- Reliable green strength holds solar ribbons in position prior to cure.
- Low temperature cure is well suited for CIGS and OPV/DSC solar cells requiring a low temperature process.
- Suitable for use on IEC 61646, IEC 61730 and UL 1703 certified solar panels.
Information Provided by Epoxy Technology |
