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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes: Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.

Advantages & Application Notes:

  • A smooth, free flowing, slightly thixotropic paste, using a 100% solids system. It can be dispensed, screen printed, or manually applied.
  • High Tg allows it to be used for high temperature applications.
  • Outstanding high temperature properties and excellent solvent, chemical and moisture resistance.
  • Extended pot life and fast curing at relatively low temperatures < 100°C.
  • Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes.
  • Contains no solvents or thinners. Passes NASA low outgassing standard ASTM E595 with proper cure
  • Can be used instead of eutectic solders for near-hermetic sealing.

Information Provided by Epoxy Technology
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.03 g/cc1.03 g/ccPart B
 2.03 g/cc2.03 g/ccPart A
Particle Size <= 45 µm<= 45 µm
Viscosity 12000 - 20000 cP
@Temperature 23.0 °C		12000 - 20000 cP
@Temperature 73.4 °F		20 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 60 ppm60 ppm
Ionic Impurities - K (Potassium) 6.0 ppm6.0 ppm
Ionic Impurities - Cl (Chloride) 175 ppm175 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080
Tensile Modulus 3.7240 GPa540.12 ksiStorage
Shear Strength >= 11.7 MPa>= 1700 psiDie
 13.7 MPa1980 psiLap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.00050 ohm-cm<= 0.00050 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 39.0 µm/m-°C21.7 µin/in-°FBelow Tg
 224 µm/m-°C124 µin/in-°FAbove Tg
Thermal Conductivity 0.940 W/m-K6.52 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C482 °FContinuous
 350 °C662 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 100 °C>= 212 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 454 °C849 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time  5.00 min
@Temperature 150 °C		0.0833 hour
@Temperature 302 °F		Minimum Bond Line
 10.0 min
@Temperature 120 °C		0.167 hour
@Temperature 248 °F		Minimum Bond Line
 20.0 min
@Temperature 100 °C		0.333 hour
@Temperature 212 °F		Minimum Bond Line
Pot Life 960 min960 min
Shelf Life 12.0 Month
@Temperature 25.0 °C		12.0 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorAmberPart B
 SilverPart A
ConsistencySmooth flowing paste
Ionic Impurities NH4148 ppm
Mix Ratio by Weight100:4.5
Number of ComponentsTwo
Thixotropic Index2.36
Weight Loss0.09%200°C
 0.23%250°C
 0.42%300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT038 / 141077

Chemically Resistant adhesives




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