Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide

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Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Categories:	Polymer; Adhesive; Thermoset; Polyimide, TS
Material Notes:	Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications. Advantages & Application Notes: Low stress die-attach adhesive that is very effective for bonding quartz crystal oscillators used in Rf / Microwave wireless devices. Designed specifically for screen printing and machine dispensing applications. A lower viscosity version, called P1011S is available for die-stamping processes. Recommended for screen printing applications; long dry time. Good electrical and thermal conductivity. Suggested for ceramic and DIP packaging of hybrids, as well as TO-Cans. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	2.39 g/cc
Particle Size	<= 20 µm
Viscosity	8000 - 12000 cP @Temperature 23.0 °C	20 rpm

Chemical Properties	Original Value	Comments
Ionic Impurities - Na (Sodium)	39 ppm
Ionic Impurities - K (Potassium)	18 ppm
Ionic Impurities - Cl (Chloride)	114 ppm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	61
Shear Strength	>= 1700 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.00050 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	32.0 µm/m-°C	Below Tg
	225 µm/m-°C	Above Tg
Thermal Conductivity	>= 2.74 W/m-K
Maximum Service Temperature, Air	225 °C	Continuous
	325 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 100 °C	Ramp 40°C/Min to 300°C
Decomposition Temperature	389 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Dry Time	<= 168 hour
Cure Time	30.0 min @Temperature 80.0 °C	Pre-Bake, Minimum Bond Line
	90.0 min @Temperature 285 °C	Post-Cure, Minimum Bond Line
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Silver
Consistency	Smooth slightly thixotropic paste
Ionic Impurities NH₄	27 ppm
Number of Components	Single
Thixotropic Index	1.9
Weight Loss	0.06%	200°C
	0.08%	250°C
	0.15%	300°C

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PPOXYT051 / 141090

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