Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide

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Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Categories:	Polymer; Adhesive; Thermoset; Polyimide, TS
Material Notes:	Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications. Advantages & Application Notes: Low stress die-attach adhesive that is very effective for bonding quartz crystal oscillators used in Rf / Microwave wireless devices. Designed specifically for screen printing and machine dispensing applications. A lower viscosity version, called P1011S is available for die-stamping processes. Recommended for screen printing applications; long dry time. Good electrical and thermal conductivity. Suggested for ceramic and DIP packaging of hybrids, as well as TO-Cans. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	2.39 g/cc	2.39 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	8000 - 12000 cP @Temperature 23.0 °C	8000 - 12000 cP @Temperature 73.4 °F	20 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	39 ppm	39 ppm
Ionic Impurities - K (Potassium)	18 ppm	18 ppm
Ionic Impurities - Cl (Chloride)	114 ppm	114 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	61	61
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	32.0 µm/m-°C	17.8 µin/in-°F	Below Tg
	225 µm/m-°C	125 µin/in-°F	Above Tg
Thermal Conductivity	>= 2.74 W/m-K	>= 19.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	225 °C	437 °F	Continuous
	325 °C	617 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 100 °C	>= 212 °F	Ramp 40°C/Min to 300°C
Decomposition Temperature	389 °C	732 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Dry Time	<= 168 hour	<= 168 hour
Cure Time	30.0 min @Temperature 80.0 °C	0.500 hour @Temperature 176 °F	Pre-Bake, Minimum Bond Line
	90.0 min @Temperature 285 °C	1.50 hour @Temperature 545 °F	Post-Cure, Minimum Bond Line
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Silver
Consistency	Smooth slightly thixotropic paste
Ionic Impurities NH₄	27 ppm
Number of Components	Single
Thixotropic Index	1.9
Weight Loss	0.06%		200°C
	0.08%		250°C
	0.15%		300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT051 / 141090

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