- Solders directly to aluminum for aluminum to copper and aluminum to aluminum connections
- Eliminating the need for plating aluminum before soldering
- Offers the low melting point temperature needed for heat pipe soldering
- Good thermal stability for heat sink reflow soldering
- Best results when soldering to 1XXX series aluminum
Description: Superior Solder Paste ASP-LT is a water-soluble formulation designed for the low temperature direct soldering of aluminum to copper for heat sinks and other aluminum connections. It also has excellent soldering characteristics for copper and nickel plated aluminum surfaces. The presence of zinc in the solder alloy of the paste permits the creation of a true intermetallic bond between the solder and the aluminum.Applications: Superior Solder Paste ASP-LT is made from Type 3 Powder (-325/+500 Mesh Powder) with a unique flux binding system for very active aluminum flux. The product is sold as a two-part paste to keep the flux from degrading the solder powder until the product is mixed. These two parts can be stored at room temperature. Once mixed the paste has a very limited shelf life of one week before the flux degrades the paste mixture beyond the point of usefulness. The ideal temperature for printing and dispensing the paste is 20º– 23°C with a relative humidity of 35-55%. Information provided by Superior Flux |
