| Description: Xylene-free version of CHO-BOND 1038; rec. bond line thickness: > 0.18 mm; primer promotes adhesion CHO-BOND® 1121 is an electrically conductive, one-component silicone adhesive-sealant that may be used for bonding EMI gaskets or for providing EMI and environmental protection as a caulk. This material cures on exposure to atmospheric moisture and contains no acetic acid or other corrosive agents. Cured CHO-BOND 1121 remains flexible and conductive at temperatures from -55°C to 125°C. Uncured CHO-BOND 1038 is a smooth, nonflowing paste that may be knife-spread or applied directly to a vertical surface. CHO-BOND 1121 forms a cured skin within two minutes after exposure to atmospheric moisture and therefore must be tooled within this time period. A full cure is obtained after room temperature aging at 50% relative humidity for one week. In many cases, a good set is obtained within 8 hours. Priming the substrate with CHO-BOND 1086 is recommended. Typical Applications: Sealing enclosure seams; airframe gap sealing; connector shielding. Information provided by Chomerics |
