Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive

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Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing. The compound cures at room temperature to form a flexible resilient conductive bond or sealant. Application Information: TECKBOND conductive adhesive-sealants are recommended wherever a flexible bond is required in a metal-to-silicone gasket application, such as TECKNIT CONSIL®-C. These adhesives are recommended in applications where the bond thickness is less than 0.016 in. [0.4 mm]. To ensure optimum bond performance, the surface of the metal may require priming Information provided by Chomerics
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Mechanical Properties	Metric	English	Comments

Shear Strength	>= 1.38 MPa	>= 200 psi	Cured; ASTM D1002
Peel Strength	>= 0.438 kN/m	>= 2.50 pli	Silicone Aluminum; Cured; ASTM D1876

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.040 ohm-cm @Temperature 25.0 °C	<= 0.040 ohm-cm @Temperature 77.0 °F	50% RH; Cured; QA-1038

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	182 °C	360 °F	Cured
Minimum Service Temperature, Air	-65.0 °C	-85.0 °F	Cured
Shrinkage	<= 1.0 %	<= 1.0 %	Cured

Processing Properties	Metric	English	Comments
Cure Time	4320 min @Temperature 25.0 °C	72.0 hour @Temperature 77.0 °F	50%; Recommended for 1/8" dia bead
	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	50%; Full Cure
Shelf Life	9.00 Month	9.00 Month	Unopened Container

Descriptive Properties
Color	Gray
Consistency	Thick Paste
Filler	Ag/Cu
Final Condition	Flexible
Number of Components	One + primer
Resin	Silicone

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PCHOME401 / 131111

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