Bakelite® MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength

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Bakelite® MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
Categories:	Polymer; Thermoset; Melamine; Melamine-Phenolic Copolymer; Phenolic
Material Notes:	Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94 V-0 / 1,5 mm (MP 4165-8899-S5), UL 94 V-0 / 1,6 mm (not listed). Applications: Commutators for electrical motors (e.g. fuel pumps, actuators, HVAC motors, fan motors, window lift motors, ABS, wiper, motors, garden appliances, household appliances, power tools, universal motors).
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Physical Properties	Metric	English	Comments

Density	1.81 g/cc	0.0654 lb/in³	ISO 1183
Apparent Bulk Density	0.650 g/cc	0.0235 lb/in³	ISO 60
Linear Mold Shrinkage	0.0015 cm/cm	0.0015 in/in	Injection Molding. Post Shrinkage = 0.25%.; ISO 2577
	0.0025 cm/cm	0.0025 in/in	Compression Molding. Post Shrinkage = 0.25%.; ISO 2577

Mechanical Properties	Metric	English	Comments
Ball Indentation Hardness	290 MPa	42100 psi	H961/30; ISO 2039/P1
Tensile Strength	60.0 MPa	8700 psi	ISO 527 - 1/2
Tensile Modulus	13.0 GPa	1890 ksi	ISO 527 - 1/2
Flexural Strength	115 MPa	16700 psi	ISO 178
Flexural Modulus	14.0 GPa	2030 ksi	ISO 178
Compressive Strength	160 MPa	23200 psi	ISO 604
Charpy Impact Unnotched	0.750 J/cm²	3.57 ft-lb/in²	ISO 179-1 eU

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+12 ohm-cm	1.00e+12 ohm-cm
Surface Resistance	1.00e+11 ohm	1.00e+11 ohm
Dielectric Constant	7.5 @Frequency 100 Hz	7.5 @Frequency 100 Hz
Dielectric Strength	28.5 kV/mm @Thickness 1.00 mm	724 kV/in @Thickness 0.0394 in	IEC 60243-P1
Dissipation Factor	0.10 @Frequency 100 Hz	0.10 @Frequency 100 Hz
Comparative Tracking Index	300 V	300 V

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	150 °C	302 °F	<20000 hours; IEC 60216-P1
	190 °C	374 °F	< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa	135 °C	275 °F	ISO 75-2

Processing Properties	Metric	English	Comments
Feed Temperature	60.0 - 75.0 °C	140 - 167 °F	Injection molding
Nozzle Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Mold Temperature	160 - 170 °C	320 - 338 °F	Injection molding
	160 - 170 °C	320 - 338 °F	Compression molding
Injection Pressure	>= 15.0 MPa	>= 2180 psi	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding

Descriptive Properties
Holding Pressure	Approximately 40-60% of injection pressure
Water absorption (mg)	20		24h / 23°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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