Cosmic Plastics FARBOSET® 1150 Mineral Filled Epoxy Molding Compound

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Cosmic Plastics FARBOSET® 1150 Mineral Filled Epoxy Molding Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Molded, Mineral Filled
Material Notes:	Description: Cosmic FARBOSET 1150 is a granular, mineral-filled, anhydride epoxy molding compound featuring fast cure rates and excellent hot strength. Applications: It is designed for the encapsulation of coils, transformers, bushings, switches and other electrical and electronic components requiring good hot rigidity in molding. This material is used extensively in injection and transfer molding. Information provided by Cosmic Plastics Inc
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Physical Properties	Metric	English	Comments

Bulk Density	0.950 g/cc	0.0343 lb/in³	powder
Density	1.95 g/cc	0.0704 lb/in³	Molded
Water Absorption	0.026 % @Time 86400 sec	0.026 % @Time 24.0 hour
Linear Mold Shrinkage	0.0060 cm/cm	0.0060 in/in
Spiral Flow	125 cm	49.2 in	EMMI 1-66A
Storage Temperature	4.00 °C	39.2 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75
Tensile Strength at Break	68.9 MPa	10000 psi
Flexural Strength	124 MPa	18000 psi
Flexural Modulus	17.2 GPa	2500 ksi
Compressive Strength	248 MPa	36000 psi
Izod Impact, Notched	0.214 J/cm	0.400 ft-lb/in

Electrical Properties	Metric	English	Comments
Volume Resistivity	3.00e+15 ohm-cm	3.00e+15 ohm-cm
Surface Resistance	1.00e+16 ohm	1.00e+16 ohm
Dielectric Constant	3.5 @Frequency 1000 Hz	3.5 @Frequency 1000 Hz
Dielectric Strength	15.7 kV/mm	400 kV/in	short time 30 mil
Dissipation Factor	0.0030 @Frequency 1000 Hz	0.0030 @Frequency 1000 Hz
Dielectric Loss Index	0.011 @Frequency 1000 Hz	0.011 @Frequency 1000 Hz
Arc Resistance	210 sec	210 sec

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.920 W/m-K	6.38 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	190 °C	374 °F
Deflection Temperature at 1.8 MPa (264 psi)	105 °C	221 °F
Glass Transition Temp, Tg	130 °C	266 °F
Flammability, UL94	HB @Thickness 1.59 mm	HB @Thickness 0.0625 in

Processing Properties	Metric	English	Comments
Mold Temperature	150 - 180 °C	302 - 356 °F
Cure Time	0.717 min @Temperature 150 °C	0.0119 hour @Temperature 302 °F	Hot Plate
	1.00 - 3.00 min @Temperature 150 °C	0.0167 - 0.0500 hour @Temperature 302 °F
Shelf Life	0.0670 Month @Temperature 35.0 °C	0.0670 Month @Temperature 95.0 °F	2 days
	0.250 Month @Temperature 25.0 °C	0.250 Month @Temperature 77.0 °F	1 week
	12.0 Month @Temperature 5.00 °C	12.0 Month @Temperature 41.0 °F

Descriptive Properties
Molding Pressure	50-1000 psi

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PCOSM025a / 325077

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